Hongyu Li

Improvement of Electromigration Lifetime of Submicrometer Dual-Damascene Cu Interconnects Through Surface Engineering

A. V. Vairagar, H. Engelmann, E. Zschech, 2006 .

Effects of plasma treatments on structural and electrical properties of methyl-doped silicon oxide low dielectric constant film

V. Bliznetsov, L. Wong, C. Tsang, 2006 .

Preparation of 4H-SiC BSIT and qualitative comparison with Si BSIT

Z. Ma, Siyuan Li, Yanfeng Jiang, 2000 .

Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects

Zhong Chen, Subodh G. Mhaisalkar, Zhenghao Gan, 2006 .

Integration of Low-κ Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief

C. S. Tan, C. Tan, Jiye Zhang, 2012 .

The effect of line width on stress-induced voiding in Cu dual damascene interconnects

Zhong Chen, Subodh G. Mhaisalkar, Zhenghao Gan, 2006 .