S. Hasaka

发表

Novel Precursor for Development of Si–C2H4–Si Networks in SiCH for Application as a Low-k Cap Layer beyond 22 nm Nodes

Y. Ohashi, N. Tajima, T. Kada, 2010 .

Effectiveness of Dimethyl Carbonate and Dipivaloyl Methane Chemicals for Internal Repair of Plasma-Damaged Low-k Films

Kiyoteru Kobayashi, S. Nagano, S. Hasaka, 2011 .

Etching of High-k Dielectric HfO2 Films in BCl3-Containing Plasmas Enhanced with O2 Addition

Kazuo Takahashi, K. Ono, Keisuke Nakamura, 2006 .

Carbon-Doped Silicon Oxide Films with Hydrocarbon Network Bonds for Low-k Dielectrics: Theoretical Investigations

S. Kondo, T. Ohno, T. Hamada, 2007 .

High-Etching-Selectivity Barrier SiC (k<3.5) Film for 32-nm-Node Copper/Low-k Interconnects

S. Saito, S. Kondo, N. Oda, 2010 .

Molecular modeling of low-k films of carbon-doped silicon oxides for theoretical investigations of the mechanical and dielectric properties

T. Hamada, N. Tajima, K. Yoneda, 2006 .

High strain embedded-SiGe via low temperature reduced pressure chemical vapor deposition

A. Reznicek, D. Sadana, T. Adam, 2012 .

Gas phase particle formation and elimination on Si (100) in low temperature reduced pressure chemical vapor deposition silicon-based epitaxial layers

D. Sadana, T. Adam, P. Brabant, 2012 .

Multiwafer atmospheric‐pressure MOVPE reactor for nitride semiconductors and ex‐situ dry cleaning of reactor components using chlorine gas for stable operation

Akira Yamaguchi, Koh Matsumoto, Hiroki Tokunaga, 2008 .