T. Dai

Diffusion Barrier Behaviors of V-Ta, V-Ta-N and V-Ta/V-Ta-N Alloy Films in Cu Interconnects

X. J. Liu, C. P. Wang, S. Y. Yang, 2020, Journal of Electronic Materials.

Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate

X. J. Liu, C. P. Wang, J. Ruan, 2017, Journal of Electronic Materials.