L. Xue

Research on BEOL Failures of the Chip-Package Interaction by Shear Tests of the Bumps

Sheng Liu, Can Sheng, Rui Li, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects

Sheng Liu, Shizhao Wang, Yameng Sun, 2022, IEEE Transactions on Electron Devices.

Surface action mechanism and design considerations for the mechanical integrity of cu/low K BEOL interconnect during chemical mechanical polishing process

Sheng Liu, Rui Li, Shizhao Wang, 2022, Microelectronics Reliability.

Online multiaxial fatigue damage evaluation method by real‐time cycle counting and energy‐based critical plane criterion

Xue Long, D.-G. Shang, Dao-Hang Li, 2020 .

Laboratory Evaluation of Microwave Heating Method for Hot In-Place Recycling

Hainian Wang, P. Hao, M. Mitchell, 2011 .