E. Amini

EOFM for contactless parameter extraction of low k dielectric MIS structures

C. Boit, T. Nakamura, N. Herfurth, 2019, 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA).

Special Session: Physical Attacks through the Chip Backside: Threats, Challenges, and Opportunities

Jean-Pierre Seifert, Shahin Tajik, Christian Boit, 2021, 2021 IEEE 39th VLSI Test Symposium (VTS).

The IC Ultra-Thin Back Surface - A Field of Real Nanoscale Fault Isolation Opportunities Requiring a Skillful Sample Preparation

C. Boit, M. DiBattista, F. Altmann, 2022, 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

IC security and quality improvement by protection of chip backside against hardware attacks

Christian Boit, Bernd Szyszka, Elham Amini, 2018, Microelectron. Reliab..

From IC debug to hardware security risk: The power of backside access and optical interaction

C. Boit, S. Tajik, P. Scholz, 2016, 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Second generation of optical IC-backside protection structure

Jean-Pierre Seifert, Christian Boit, Elham Amini, 2020, 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Assessment of a Chip Backside Protection

Christian Boit, Bernd Szyszka, Elham Amini, 2018, J. Hardw. Syst. Secur..

STUDENT PAPER: Backside Protection Structure for Security Sensitive ICs

Elham Amini, E. Amini, 2017 .