M. Nguyen

HF etching mechanisms of advanced low-k films

S. Van Elshocht, K. Vanstreels, S. Armini, 2014, IEEE International Interconnect Technology Conference.

Characterization of Patterned Porous Low-k Dielectrics: Surface Sealing and Residue Removal by Wet Processing/Cleaning

B. T. Chan, T. Conard, S. Gendt, 2016 .

Investigation of magnetic phase transition and magnetocaloric effect of (Ni,Co)-Mn-Al melt-spun ribbons

V. Koledov, A. Mashirov, A. Kamantsev, 2018 .

Diffusion barrier property of MnSixOy layer formed by chemical vapor deposition for Cu advanced interconnect application

Y. Sutou, J. Koike, M. Nguyen, 2015 .