O. Jung

Oxidation of the TA Diffusion Barrier and Its Effect on the Reliability of CU Interconnects

J. Im, P. Ho, W. Baek, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Characterization and integration of new porous low-k dielectric (k < 2.3) for 65 nm technology and beyond

J. H. Park, B. Min, Sang Jong Park, 2007 .