R. He

Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

H. H. Yap, D. D. Wang, P. K. Tan, 2015 .

Cross-sectional nanoprobing fault isolation technique on submicron devices

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..

Si nano-particle characterization by atomic force microscopy and electronic beam techniques

P. K. Tan, Binghai Liu, Z. Mai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique

Ran He, Hao Tan, Pik Kee Tan, 2018, Microelectronics and reliability.

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system

L. Zhu, Ran He, Hao Tan, 2016, Microelectron. Reliab..

Electrical characteristics of leakage issues caused by defective Ni salicide

P. K. Tan, Z. Mai, J. Lam, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

A sample preparation methodology to reduce sample edge unevenness and improve efficiency in delayering the 20-nm node IC chips

H. H. Yap, D. D. Wang, P. K. Tan, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Ran He, Y. Z. Zhao, B. Liu, 2015, Microelectron. Reliab..