M. Lederer

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions

M. Thoben, Golta Khatibi, Bernhard Czerny, 2012, Microelectron. Reliab..

Delamination of polyimide/Cu films under mixed mode loading

T. Walter, Golta Khatibi, M. Lederer, 2016, Microelectron. Reliab..

High cycle fatigue testing of thermosonic ball bonds

Golta Khatibi, Michael Nelhiebel, M. Lederer, 2017, Microelectron. Reliab..

Effect of aging on mechanical properties of high temperature Pb-rich solder joints

Golta Khatibi, A. Betzwar Kotas, M. Lederer, 2018, Microelectron. Reliab..

Reliability of Cu wire bonds in microelectronic packages

Johann Nicolics, Golta Khatibi, Bernhard Czerny, 2017, Microelectron. Reliab..