Renkuan Liu

Thermal Contact Resistance Optimization of Press-Pack IGBT Device Based on Liquid Metal Thermal Interface Material

Wei Lai, Xianping Chen, Hui Li, 2022, IEEE Transactions on Power Electronics.

A Non-Destructive Testing Method for Fault Detection of Substation Grounding Grids

Yao Wang, Zhihong Fu, Lin Chen, 2019, Sensors.

Overview of monitoring methods of press‐pack insulated gate bipolar transistor modules under different package failure modes

Wei Lai, Hui Li, Hongtao Tan, 2022, IET Power Electronics.

Reactive-voltage coordinated control of offshore wind farm considering multiple optimization objectives

Hui Li, Hongtao Tan, Jie Zheng, 2022, International Journal of Electrical Power & Energy Systems.

Investigation on the Short-circuit Withstand Capability of Press-pack IGBT modules with Optimized Package Structures

F. Iannuzzo, Wei Lai, Ran Yao, 2023, 2023 24th International Vacuum Electronics Conference (IVEC).

Testing and Assessment on the Short-Circuit Withstand Capability of Press-Pack IGBT Considering the Unbalanced Clamping Forces

Wei Lai, Hui Li, Hongtao Tan, 2023, IEEE Journal of Emerging and Selected Topics in Power Electronics.

Research on Long-term Reliability of Silver Sintered Press-Pack IGBT Modules

Wei Lai, Hongtao Tan, Ran Yao, 2022, Power Electronic Devices and Components.

Optimization on Thermomechanical Behavior for Improving the Reliability of Press Pack IGBT Using Response Surface Method

Xianping Chen, Hui Li, Jinyuan Li, 2021, IEEE Journal of Emerging and Selected Topics in Power Electronics.

A Thermal Twin Modeling Method of Press Pack IGBT Based on Power Loss

Wei Lai, Hui Li, Ran Yao, 2022, IEEE Transactions on Electron Devices.