Dashun Liu

The Influence of Molding Compound Properties on System-in-Package Reliability for 5G Application

Jingshen Wu, Ke Xue, Dong Lu, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

Sensitivity Design and Reliability Analysis of Pressure-sensitive Layer for 5G Flexible Wearable Sensors

Limin Zhou, Yijing Qin, M. Qu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Rate-dependent lithiation-induced failure modes of a cylindrical core-shell electrode

Kai Zhang, Yong Li, B. Zheng, 2020 .

Effect of Secondary Orientation on the Mechanical Behavior of a Unit Cell Model with a Film-cooling Hole in Single Crystal

Z. Yue, Z. Wen, Dashun Liu, 2017 .

Work in Progress: Network Attack Detection Towards Smart Factory

Dongshuo Zhang, Jingwen Chen, Huan Zhao, 2021, 2021 IEEE 27th Real-Time and Embedded Technology and Applications Symposium (RTAS).

Study of cu wire crack under thermal cycling test

Jingshen Wu, H. Fan, Haibin Chen, 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Determination of Parameters in Mixed-Mode Cohesive Zone Models for Modified Button Shear Tests by Particle Swarm Optimization

Ke Xue, Weijing Dai, Dashun Liu, 2021, International Conference on Electronic Packaging Technology.