J. Teufel
发表
M. Hirscher,
M. Wahiduzzaman,
D. Volkmer,
2013,
Advanced materials.
M. Hirscher,
Hyunchul Oh,
A. Mavrandonakis,
2015
.
Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering
U. Welzel,
M. Sobiech,
J. Teufel,
2011
.