R. Miller

Reliability versus yield and die location in deep sub-micron VLSI

W. C. Riordan, R. Miller, J. Hicks, 2000, Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130).

Reliability versus yield and die location in advanced VLSI

W. C. Riordan, R. Miller, J. Hicks, 1999 .

Multi parameter method for yield analysis and reliability assessment

B. Lisenker, Y. Mitnick, R. Miller, 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).

Microprocessor reliability performance as a function of die location for a 0.25 /spl mu/, five layer metal CMOS logic process

W. C. Riordan, R. Miller, J. Hicks, 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).