H. Tian

发表

A Comparative Study on the Microstructure and Mechanical Properties of Cu6Sn5 and Cu3Sn Joints Formed by TLP Soldering With/Without the Assistance of Ultrasonic Waves

Xiaoguo Song, H. Niu, Y. Zhao, 2018, Metallurgical and Materials Transactions A.

Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.

Z. L. Li, H. Zhao, J. C. Yan, 2018, Ultrasonics sonochemistry.

Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process

Xiaoguo Song, Hua Zhao, Jiuchun Yan, 2017 .

Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures

Xiaoguo Song, Jiuchun Yan, Z. L. Li, 2017 .

Experimental investigations for electric heating rotary stretch bending process of extruded Ti-6Al-4V alloy profile with T-section

Tianjiao Liu, Yongjun Wang, Weichao Wu, 2017 .

The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles

Xiaoguo Song, Z. L. Li, H. Tian, 2018, Scripta Materialia.

Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process.

Z. L. Li, H. Zhao, H. Dong, 2017, Ultrasonics sonochemistry.

Influence of Ni particle addition on grain refinement of Cu-Sn intermetallic compound joints bonded at various temperatures

Xiaoguo Song, Z. L. Li, Xinghua Guo, 2019, Journal of Alloys and Compounds.

Microstructure evolution, grain morphology variation and mechanical property change of Cu-Sn intermetallic joints subjected to high-temperature aging

Xiaoguo Song, Y. Zhao, Hongyun Zhao, 2018 .