Zheng-hu Zhu

Creep Behavior of Annealed Lead-free Solder for High-power Electronic Device

X. Long, Yao Yao, Yan-pei Wu, 2018 .

Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures

X. Long, Lijuan Huang, Zheng-hu Zhu, 2022, Multidiscipline Modeling in Materials and Structures.

Board-level vapor phase soldering (VPS) with different temperature and vacuum conditions

X. Long, Lijuan Huang, Zheng-hu Zhu, 2019, Multidiscipline Modeling in Materials and Structures.

Effect of surface energy on the bond strength of conductive adhesive

Jiu-hua Xu, X. Long, Hairui Wu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).