T. Hatao

Development of Analysis Methodology to Predict the Hysteresis of the Warpage of an Electronic Package during a Thermal History

N. Miyazaki, M. Koganemaru, T. Ikeda, 2015 .

Fatigue-Fracture Surface of Polycarbonate Subjected to Heating/Cooling Cycles under Longitudinal Confinement

Mitsuru Tanahashi, K. Takeda, A. Katsumura, 2006 .

Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method

Hiroyuki Tanaka, Toru Ikeda, Nobuyuki Shishido, 2013, Microelectron. Reliab..

Strain measurement in micro-electronic packages using the digital image correlation method

N. Miyazaki, T. Ikeda, Hiroyuki Tanaka, 2011 .

Evaluation and Improvement of the Accuracy of Nonlinear Finite Element Analysis for a 3 D SIC package using the thermal strain measurement with SEM and DICM

Masatoshi, S. Kohara, F. Yamada, 2013 .