S. Kim

发表

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

D. Byun, Min-Su Kim, Dong-Yurl Yu, 2021, Materials.

Neural-based Blind Modeling of Mini-mill ASC Crown

Hae-Doo Park, Dong-Il Lee, Suk-Gyu Lee, 2002 .

Thermal reliability of Cu sintering joints for high-temperature die attach

D. Byun, Dong-Yurl Yu, Junghwan Bang, 2023, Microelectronics Reliability.

Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

D. Byun, Dong-Yurl Yu, Junghwan Bang, 2023, Journal of Materials Science: Materials in Electronics.