Taein Shin
发表
Joungho Kim,
Seongguk Kim,
Subin Kim,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2019,
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS).
Joungho Kim,
Subin Kim,
Shinyoung Park,
2019,
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC).
Seongguk Kim,
Joungho Kim,
Junyong Park,
2019,
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2020,
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
Joungho Kim,
Seongguk Kim,
Subin Kim,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Seongguk Kim,
Joungho Kim,
Subin Kim,
2019,
2019 IEEE Asia-Pacific Microwave Conference (APMC).
Joungho Kim,
Seongguk Kim,
Kyungjun Cho,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.