J. Romero

2020 Otto Aufranc Award: Malseating of modular dual mobility liners.

T. Wright, D. Padgett, Yu-Fen Chiu, 2020, The bone & joint journal.

Void-free Copper Electrodeposition in High Aspect Ratio, Full Wafer Thickness Through-Silicon Vias with Endpoint Detection

J. Bower, N. Jackson, M. Jordan, 2021 .

Simulations of the effects of proppant placement on the conductivity and mechanical stability of hydraulic fractures

R. Rao, S. Bauer, J. Lechman, 2017 .