Xiao Lu

发表

Structure and properties of low-Ag SAC solders for electronic packaging

L. Zhang, Mu-lan Li, Xiao Lu, 2022, Journal of Materials Science: Materials in Electronics.

Growth Behavior and Reliability of Interfacial Imc for Sn58bi/Cu and Sn58bi-Aln/Cu Solder Joints Applied in Igbt Modules

Y. Liu, L. Zhang, Lei Sun, 2022, SSRN Electronic Journal.

Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles

L. Zhang, Li-li Gao, Yong-huan Guo, 2023, Journal of Materials Research and Technology.

Review of ultrasonic-assisted soldering in Sn-based solder alloys

L. Zhang, Li-li Gao, Su-juan Zhong, 2023, Journal of Materials Science: Materials in Electronics.

Interfacial IMC growth behavior and mechanical properties of Cu/Sn58Bi/Cu and Cu/Sn58Bi–0.05AlN/Cu solder joints under ultrasonic-assisted soldering

L. Zhang, W. Long, Chen Chen, 2023, Journal of Materials Science: Materials in Electronics.

Microstructure Evolution and Thermal, Wetting, Mechanical Properties of Sic Nanowires Reinforced Sac105 Composite Solder

L. Zhang, Li-li Gao, Yong-huan Guo, 2023, SSRN Electronic Journal.

Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles

L. Zhang, Yong-huan Guo, Chen Chen, 2023, Journal of Materials Research and Technology.

Theoretical analysis of polymer optical waveguide with Gaussian-shaped core

L. Zhang, F. Pang, Tingyun Wang, 2022, Photonics and Optoelectronics Meetings.

Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate

L. Zhang, Li-Yin Gao, Zhi-Quan Liu, 2023, Journal of Materials Research and Technology.

Interfacial Structures and Mechanical Properties of Cu/Sn/Cu Containing Sic Nanowires Under Transient Liquid Phase Bonding

L. Zhang, Mu-lan Li, Li-li Gao, 2022, SSRN Electronic Journal.