Christian Ehrhardt

Static code analysis in multi-threaded environments

Christian Ehrhardt, Christian Ehrhardt, 2007 .

The reliability of wire bonding using Ag and Al

Christian Ehrhardt, Martin Schneider-Ramelow, M. Schneider-Ramelow, 2016, Microelectron. Reliab..

Advanced packaging methods for high-power LED modules

Christian Ehrhardt, Constanze Weber, Rafael C. Jordan, 2014, Photonics West - Optoelectronic Materials and Devices.

Transient Liquid Phase Soldering als Verbindungstechnik leistungselektronischer Halbleiter für Hochtemperaturanwendungen

Christian Ehrhardt, 2017 .

Transient Liquid Phase Soldering for lead-free joining of power electronic modules in high temperature applications

Klaus-Dieter Lang, Christian Ehrhardt, Matthias Hutter, 2012 .

Packaging and Characterization of Silicon and SiC-based Power Inverter Module with Double Sided Cooling

Klaus-Dieter Lang, Marta Rencz, Bernhard Wunderle, 2016 .

A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)

Klaus-Dieter Lang, Christian Ehrhardt, Matthias Hutter, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).