Jose Campos

Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology

Paul Lindner, Jürgen Burggraf, Steffen Kroehnert, 2016 .

FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules

Abel Janeiro, Steffen Kroehnert, Jose Campos, 2015 .

Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out)

Leonor Dias, Steffen Kroehnert, Jose Campos, 2016 .