Markus Wimplinger

发表

Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology

Paul Lindner, Jürgen Burggraf, Steffen Kroehnert, 2016 .

Recent progress in thin wafer processing

Paul Lindner, Thomas Uhrmann, Harald Wiesbauer, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Room temperature bond for wafer level packaging

Christine Thanner, Paul Lindner, Thomas Glinsner, 2003 .

Advanced wafer bonding solutions for TSV integration with thin wafers

Paul Lindner, Markus Wimplinger, Thorsten Matthias, 2009, 2009 IEEE International Conference on 3D System Integration.

Application of imprint technologies for creation of micro- and nanoscale pattern

Paul Lindner, Thomas Glinsner, Markus Wimplinger, 2004, SPIE Micro + Nano Materials, Devices, and Applications.

Beginning-to-end wafer bonding for advanced optical systems

Paul Lindner, Markus Wimplinger, Shari Farrens, 2003, SPIE Optics + Photonics.

Enabling Wafer Level Processes for CIS Manufacturing

Viorel Dragoi, Paul Lindner, Eric Pabo, 2010 .

Novel Bonding technologies for wafer-level transparent packaging of MOEMS pdf

Paul Lindner, Markus Wimplinger, Herwig Kirchberger, 2008, ArXiv.

Soft UV-based nanoimprint lithography for large-area imprinting applications

Thomas Glinsner, Markus Wimplinger, U. Plachetka, 2007, SPIE Advanced Lithography.

Industrial applications demanding low and high resolution features realized by soft UV-NIL and hot embossing

Paul Lindner, Thomas Glinsner, Markus Wimplinger, 2009, Advanced Lithography.

Monolithic IC integration key alignment aspects for high process yield

Paul Lindner, Thomas Glinsner, Thomas Uhrmann, 2014, 2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects

Eric Beyne, Andy Miller, Joeri De Vos, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Reversible wafer bonding for reliable compound semiconductor processing

Viorel Dragoi, Gerald Mittendorfer, Paul Lindner, 2002, Proceedings. International Semiconductor Conference.

Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy

Jian-Qiang Lu, Ronald J. Gutmann, Timothy S. Cale, 2004 .

Mechanisms for room temperature direct wafer bonding

Viorel Dragoi, Kurt Hingerl, Markus Wimplinger, 2013 .

CMOS image sensor wafer-level packaging

Viorel Dragoi, Paul Lindner, Markus Wimplinger, 2011, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.

High-Performance Temporary Adhesives for Wafer Bonding Applications

Rama Puligadda, Markus Wimplinger, Chad Brubaker, 2006 .

Wafer edge defect study of temporary bonded and thin wafers in TSV process flow

Paul Lindner, Sina Jahanbin, Thomas Uhrmann, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Viorel Dragoi, Gerald Mittendorfer, Jürgen Burggraf, 2010 .

3D Process Integration – Wafer-to-Wafer and Chip-to-Wafer Bonding

Paul Lindner, Markus Wimplinger, Thorsten Matthias, 2006 .

Advanced Anodic Bonding Processes For MEMS Applications

Viorel Dragoi, Paul Lindner, Thomas Glinsner, 2003 .

A full-process chain assessment for nanoimprint technology on 200-mm industrial platform

Laurent Pain, Cyrille Laviron, Jerome Hazart, 2017 .

High-Temperature Spin-On Adhesives for Temporary Wafer Bonding

Markus Wimplinger, R. Puligadda, Stefan Pargfrieder, 2007 .