N. Jürgensen

Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging

K. Zoschke, K. Lang, P. Mackowiak, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration

H Reichl, K Zoschke, H. Reichl, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).