Francy John Akkara

发表

Characterization of Thermally Induced Stress in IC Packages using Piezoresistive Sensors

Francy John Akkara, 2015 .

Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C

Michael C. Hamilton, Jeffrey C. Suhling, Richard C. Jaeger, 2014 .