J. Yi

Multi-layered electroless Ni–P coatings on powder-sintered Nd–Fe–B permanent magnet

Zhong Chen, Zhong Chen, Alice Ng, 2006 .

Electroless nickel bath for wafer bumping: influence of additives

X. Chen, J. Yi, G. Qi, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Effects of Cu content on microstructures and compressive mechanical properties of CNTs/Al-Cu composites

Biao Chen, Zhenfei Yu, Qi‐Wei Wang, 2022, Transactions of Nonferrous Metals Society of China.