Tadashi Kurashina

Electroplated Ni-P film for power devices without cracks induced by high temperature heating

M. Shimizu, S. Arai, Y. Fujimori, 2022, Microelectronics Reliability.

Site-selective electroless nickel plating on patterned thin films of macromolecular metal complexes.

H. Shirai, M. Kimura, Hiroki Yamagiwa, 2010, ACS applied materials & interfaces.

Electroless Gold Plating Using Erythorbic Acid as Reducing Agent

N. Shinohara, N. Kaneko, H. Nawafune, 2006 .

Practical Use of 1-octadecanethiol Self-assembly Monolayers Obtained from Aqueous Micellar Solution as Corrosion Inhibitor for Printed Wiring Boards

Koji Takahashi, K. Ono, Tadashi Kurashina, 2013 .