Zhong Zhao

发表

Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application.

Qingfeng Li, L. Du, Y. Tao, 2016, Ultrasonics sonochemistry.

Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate.

Zheng Xu, L. Du, Ligeng Shao, 2016, Ultrasonics sonochemistry.

Study on Internal Stress in Micro-Electroformed Layer

Qingfeng Li, Penghe Yin, L. Du, 2015 .

Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process

L. Du, Zhong Zhao, 2015 .

Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate

Pengcheng Zhu, Y. Geng, Zhong Zhao, 2018, Journal of Adhesion Science and Technology.

To reduce the passivation layer of Cu substrate by the ultrasonic assisted electrochemical potential activation method

Pengcheng Zhu, Zhong Zhao, 2021, Micro & Nano Letters.

A new ultrasonic electrochemical potential activation method to enhance the adhesion strength between electroforming layer and Cu substrate

Pengcheng Zhu, Zhong Zhao, Qing Zhang, 2021 .

Influence of electrodeposited crystallite size on interfacial adhesion strength of electroformed layers

L. Du, Zhong Zhao, Z. Tan, 2014 .

Solving the Bonding Problem of the Ni Thin Coating with the Ultrasonic Assisted Electrochemical Potential Activation Method

Zhong Zhao, G. Huo, Huifang Li, 2022, Micromachines.