B. Muir

The effect of nickel on the strain evolution in chemical copper films

L. Perry, R. Brüning, F. Brüning, 2012 .

Strain Analysis of Copper Films During Wet-Chemical Deposition.

L. Perry, R. Brüning, F. Brüning, 2012 .

Strain in electroless copper films monitored by X-ray diffraction during and after deposition and its dependence on bath chemistry

J. Etzkorn, R. Brüning, F. Brüning, 2011 .

Analysis of the electrical and mechanical time response of solid polymer–platinum composite membranes

A. Kucernak, B. Muir, 2001 .