Peter Corkery
发表
Dennis T. Lee,
D. Fairbrother,
M. Tsapatsis,
2021,
Chemical communications.
Dennis T. Lee,
Hae‐Kwon Jeong,
M. Tsapatsis,
2022,
Annual review of chemical and biomolecular engineering.
Numerical simulation of atomic layer deposition for thin deposit formation in a mesoporous substrate
I. Kevrekidis,
M. Kooshkbaghi,
Dennis T. Lee,
2021,
AIChE Journal.
Dennis T. Lee,
M. Tsapatsis,
Liwei Zhuang,
2023,
Industrial & Engineering Chemistry Research.
Dennis T. Lee,
D. Nykypanchuk,
J. Boscoboinik,
2024,
ACS applied materials & interfaces.