L. Petit

Pressure‐Stable Air‐Retaining Nanostructured Surfaces Inspired by Natural Air Plastrons

M. Kavalenka, H. Hölscher, Felix Vüllers, 2018 .

Solid state interaction between a Sn–Ag–Cu–In solder alloy and Cu substrate

F. Hodaj, C. Lejuste, L. Petit, 2013 .

Tin Whisker formation - results, test methods and countermeasures

M. Dittes, P. Obemdorff, L. Petit, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Undercooling of Sn–Ag–Cu alloys: solder balls and solder joints solidification

L. Baggetto, F. Hodaj, L. Petit, 2013 .