Wei-Cheng Jhu

Electromigration and thermomigration of Pb-free microbumps in three-dimensional integrated circuits packaging

Tsung-han Yang, Hao Hsu, F. Ouyang, 2014, 2014 International Conference on Electronics Packaging (ICEP).

Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits

Tao-Chih Chang, F. Ouyang, Fan-Yi Ouyang, 2013 .

Comparison of thermomigration behaviors between Pb-free flip chip solder joints and microbumps in three dimensional integrated circuits: Bump height effect

F. Ouyang, Wei-Cheng Jhu, 2013 .