T. Kanno

An analysis of local deformation of SnAgCu solder joint using digital image correlation

Hua Lu, C. Bailey, C. Hunt, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method

Hiroyuki Tanaka, Toru Ikeda, Nobuyuki Shishido, 2013, Microelectron. Reliab..

Strain measurement in micro-electronic packages using the digital image correlation method

N. Miyazaki, T. Ikeda, Hiroyuki Tanaka, 2011 .

The 3D Helical Keyboard

Michael Cohen, Toshifumi Kanno, Michael Cohen, 2001, New Interfaces for Musical Expression.