Xuemei Li

Optimization of process parameters for electromagnetic induction heating assisted extrusion of magnesium alloy AZ91D internal thread

Z. Ji, Meng Liu, Xuemei Li, 2022, Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science.

Geometric size effects on the elements consuming at the solder pad under current stressing

F. Sun, Yang Liu, Hao Zhang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

Effect of temperature on interface diffusion in micro solder joint under current stressing

F. Sun, Hao Zhang, Tong Xin, 2015 .

Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

Yang Liu, Fenglian Sun, F. Sun, 2014, Journal of Materials Science: Materials in Electronics.

The effects of solder joint height on the solid–liquid interface diffusion in micro solder joints

Liping Wang, F. Sun, Lei Zhu, 2022, Materials Letters.

Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints

F. Sun, Dawei Wang, Cheng Li, 2021, Journal of Electronic Materials.

Interfacial reactions in molten state micro solder joints under current stressing

F. Sun, Hao Zhang, Meng Liu, 2018 .

Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging

F. Sun, Yang Liu, Hao Zhang, 2014, Journal of Materials Science: Materials in Electronics.

Multi-scale microstructure strengthening strategy in CoCrFeNiNb0.1Mo0.3 high entropy alloy overcoming strength-ductility trade-off

Xin Zhang, Sicong Zhao, Lei Wang, 2023, Materials Science and Engineering: A.