M. R. Locatelli

Wettability of Al2O3 by liquid Cu as influenced by additives and partial transient liquid-phase bonding of Al2O3

H. Matsumoto, K. Mori, K. Nakashima, 1995 .

New approaches to joining ceramics for high-temperature applications

A. Tomsia, K. Nakashima, B. Dalgleish, 1997 .

Transient Liquid Phase (TLP) Routes to the Joining of Structural Ceramics

K. Nakashima, R. A. Marks, A. M. Glaeser, 1998 .

New Strategies for Joining Ceramics for High-Temperature Applications

A. Tomsia, K. Nakashima, B. Dalgleish, 1995 .

Low temperature routes to joining ceramics for high-temperature applications

A. Tomsia, K. Nakashima, B. Dalgleish, 1994 .