M. Hosseini

ALD Mo for Advanced MOL Local Interconnects

N. Horiguchi, N. Jourdan, J. Maes, 2022, 2022 IEEE International Interconnect Technology Conference (IITC).

Amorphous Co-Ti alloy as a single layer barrier for Co local interconnect structure

Larry Zhao, Yuji Sutou, Junichi Koike, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Material innovation for MOL, BEOL, and 3D integration

D. Ando, H. Hai, Y. Sutou, 2017, 2017 IEEE International Electron Devices Meeting (IEDM).

Amorphous CoTix as a liner/diffusion barrier material for advanced copper metallization

J. Koike, M. Hosseini, 2017 .

Co and CoTix for contact plug and barrier layer in integrated circuits

Daisuke Ando, Yuji Sutou, Junichi Koike, 2018 .

Ru as an alternative material for advanced contacts

M. H. van der Veen, S. Demuynck, N. Horiguchi, 2020, 2020 IEEE International Interconnect Technology Conference (IITC).

Synthesis of different copper nanostructures by the use of polyol technique

S. Marashi, D. H. Fatmehsari, M. Hosseini, 2015, Applied Physics A.

Middle-of-line plasma dry etch challenges for buried power rail integration

H. Mertens, N. Horiguchi, A. Veloso, 2022, Advanced Lithography.