S. T. Chen

发表

Out-of-plane thermal expansion coefficient of biphenyldianhydride-phenylenediamine polyimide film

H. H. Wagner, S. T. Chen, 1993 .

Evaluation of single- and multilayered amorphous tantalum nitride thin films as diffusion barriers in copper metallization

G. S. Chen, L. Yang, Pee-Yew Lee, 2000 .

Growth of ultrathin barrier layers with sub-5-nm metallic seeds fabricated by sequential treatments of vacuum plasma and electrochemical solution

G. S. Chen, C. Hsu, Giin-Shan Chen, 2008 .

Atom motion of Cu and Co in Cu damascene lines with a CoWP cap

Robert Rosenberg, S. T. Chen, C-K. Hu, 2004 .

Thermal And Mechanical Properties Of Polyimide Films

S. T. Chen, 1995 .

Adhesion and deformation of metal/polyimide layered structures

Franz Faupel, P. S. Ho, P. Ho, 1989 .

Temperature Dependence of Stress Relaxation at the Copper/Polyimide Interface

P. Ho, C. Yang, H. Tong, 1986 .

Stress relaxation during thermal cycling in metal/polyimide layered films

Franz Faupel, Paul S. Ho, P. Ho, 1988 .

Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps

Andrew H. Simon, Chao-Kun Hu, S. T. Chen, 2003 .

Effects of deposition and annealing atmospheres on phase transition of tungsten oxide films grown by ultra-high-vacuum reactive sputtering

C. Lin, W. Su, W. Liao, 2005 .