C. Tan

Adhesion of thin films

M. Ozenbas, C. Tan, 1986 .

Formation of pyramids at surface of TMAH etched silicon

W. K. Choi, J. Thong, Y. Bai, 1999 .

Experimental study on the nanoindentation of thin copper films from deep submicron to nano-scale

Ching-Yang Cheng, Y. Jeng, C. Su, 2012 .

Integration of Low-κ Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief

C. S. Tan, C. Tan, Jiye Zhang, 2012 .

Characterisation of pyramid formation arising from the TMAH etching of silicon

John T. L. Thong, Wee Kiong Choi, W. K. Choi, 1998 .

Revisiting Contact Electrification at Polymer-Liquid Interfaces.

Ran Xu, Qing Zhang, C. Tan, 2022, Langmuir : the ACS journal of surfaces and colloids.

Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder

S. Nai, H. Jing, L. Y. Xu, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Enhancing the properties of a lead-free solder with the addition of Ni-coated carbon nanotubes

S. Nai, H. Jing, Y. Han, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Mechanism of sol–gel intermediate layer low temperature wafer bonding

W. B. Yu, S. Deng, C. Tan, 2005 .