Khin Maung Latt

Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

Y. K. Lee, W. Zhu, T. Osipowicz, 2002 .

Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure

Y. K. Lee, T. Osipowicz, Khin Maung Latt, 2001 .