J. Baumann

Electrical characterization of reactively sputtered TiN diffusion barrier layers for copper metallization

C. Kaufmann, T. Gessner, M. Rennau, 1995 .

Comparative study of Cu and CuAl 0.3 wt.% films

C. Kaufmann, T. Gessner, P. Gilman, 2001 .

Sputtering of silicon thin films for passivated contacts

R. Köhler, E. Schneiderlöchner, Jan Hoß, 2019, 15th International Conference on Concentrator Photovoltaic Systems (CPV-15).

Automated neurosphere sorting and plating by the COPAS large particle sorter is a suitable method for high-throughput 3D in vitro applications.

K Gassmann, J Baumann, S Giersiefer, 2012, Toxicology in vitro : an international journal published in association with BIBRA.

Influence of different treatment techniques on the barrier properties of MOCVD TiN against copper diffusion

S. Schulz, T. Gessner, M. Rennau, 2000 .

Investigation of copper metallization induced failure of diode structures with and without a barrier layer

Thomas Gessner, C. Kaufmann, C. Kaufmann, 1997 .

W/TiN double layers as barrier system for use in Cu metallization

C. Kaufmann, T. Gessner, M. Rennau, 1997 .