D. Roy

Reliability failure modes in interconnects for the 45 nm technology node and beyond

E. Petitprez, E. Richard, Y. Le Friec, 2009, 2009 IEEE International Interconnect Technology Conference.

Copper line topology impact of SiOCH low-k dielectric reliability in advanced 45nm technology node and beyond

M. Vilmay, F. Volpi, J. Chaix, 2008, 2008 IEEE International Integrated Reliability Workshop Final Report.

Advanced 45nm MOSFET small-signal equivalent circuit aging under DC and RF hot carrier stress

G. Ghibaudo, D. Gloria, D. Roy, 2011, 2011 International Reliability Physics Symposium.

Hot carrier impact on the small signal equivalent circuit

G. Ghibaudo, D. Gloria, D. Roy, 2010, 2010 IEEE International Integrated Reliability Workshop Final Report.

Copper line topology impact on the SiOCH low-k reliability in sub 45nm technology node. From the time-dependent dielectric breakdown to the product lifetime

F. Volpi, C. Monget, M. Vilmay, 2009, 2009 IEEE International Reliability Physics Symposium.

Copper-Line Topology Impact on the Reliability of SiOCH Low- $k$ for the 45-nm Technology Node and Beyond

F. Volpi, C. Monget, M. Vilmay, 2008, IEEE Transactions on Device and Materials Reliability.

Copper line topology impact on the reliability of low-k SIOCH for the 45nm technology node and beyond

M. Vilmay, F. Volpi, J. Chaix, 2008, 2008 IEEE International Integrated Reliability Workshop Final Report.