T. Decorps

Electroless deposition of CoWP: Material characterization and process optimization on 300mm wafers

A. Roule, P. Haumesser, G. Passemard, 2006 .

Thin film characterization by total reflection x-ray fluorescence

J. Hartmann, S. Lhostis, H. Kohno, 2008 .

Inhomogeneous nucleation and growth of palladium and alloyed cobalt during self-aligned capping of advanced copper interconnects

P. Haumesser, G. Passemard, C. Cayron, 2010 .

Self Aligned Barrier Approach: Overview on Process, Module Integration and Interconnect Performance Improvement Challenges

P. Haumesser, J. Flake, J. Michelon, 2006, 2006 International Interconnect Technology Conference.