Pradeep Lall

发表

Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads

Pradeep Lall, Madhura Hande, Chandan Bhat, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging

Pradeep Lall, Lynn Davis, Peter Sakalaukus, 2015, IEEE Access.

Fault-Mode Classification of Solid State Luminaires Using Bayesian Probabilistic Models

Pradeep Lall, Junchao Wei, Peter Sakalaukus, 2014 .

Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics

Pradeep Lall, Jeffrey C. Suhling, Aniket Shirgaokar, 2008 .

Reliability of a CBGA miroproessor package incorpoating a decoupling capacitor array

Pradeep Lall, Chandan Bhat, Richard C. Jaeger, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Effect of Print Parameters on Print Consistency of Aerosol Jet Printed Electronics

Pradeep Lall, Scott Miller, Amrit Abrol, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann Constants for Leadfree Electronics

Pradeep Lall, Jeffrey C. Suhling, Dinesh Arunachalam, 2011 .

PHM of state-of-charge for flexible power sources in wearable electronics with EKF

Pradeep Lall, Hao Zhang, Rahul Lall, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

A study on damage progression in MEMS based Silicon oscillators subjected to high-g harsh environments

Pradeep Lall, Amrit Singh Abrol, Lee Simpson, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

RT 184: Electronic Survivability in Harsh Environments

Pradeep Lall, 2018 .

Prognostication of Accrued Damage and Impending Failure Under Temperature-Vibration in Leadfree Electronics

Pradeep Lall, Tony Thomas, Jeff Suhling, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging

Pradeep Lall, Jeffrey C. Suhling, Muhannad Mustafa, 2016, Microelectron. Reliab..

Drop Reliability of Corner Bonded CSP in Portable Products

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2003 .

Particle filter models and phase sensitive detection for prognostication and health monitoring of leadfree electronics under shock and vibration

Pradeep Lall, Kai Goebel, Ryan Lowe, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

X-ray micro-CT and DVC based analysis of strains in metallization of flexible electronics

Pradeep Lall, Junchao Wei, P. Lall, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Statistical Pattern Recognition andBuilt-in Reliability TestforFeature Extraction andHealthMonitoring ofElectronics underShockLoads

Pradeep Lall, P. Choudhary, Jeff Suhling, 2007 .

Study on the effect of fixtures on deformation and warpage of the double-sided flexible printed circuit board through reflow using DIC

Pradeep Lall, Kartik Goyal, P. Lall, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Identification of failure modes in portable electronics subjected to mechanical-shock using supervised learning of damage progression

Pradeep Lall, Kai Goebel, Prashant Gupta, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact

Pradeep Lall, Jeffrey C. Suhling, Dhananjay Panchagade, 2006 .

Finite Element Parametric Analysis on Fine-Pitch BGA (FBGA) Packages

Pradeep Lall, Desmond Y.R. Chong, Chuen Khiang Wang, 2003 .

Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics

Pradeep Lall, Aniket Shirgaokar, Dinesh Arunachalam, 2012 .

Prognostic health monitoring for a micro-coil spring interconnect subjected to drop impacts

Pradeep Lall, Kai Goebel, Ryan Lowe, 2013, 2013 IEEE Conference on Prognostics and Health Management (PHM).

Printed Wiring Board Design and Fabrication

Pradeep Lall, Denise Burkus Harris, 2018 .

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover, 2015 .

Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000g

Pradeep Lall, Tony Thomas, Ken Blecker, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Bayesian probabilistic model for life prediction and fault mode classification of solid state luminaires

Pradeep Lall, Peter Sakalaukus, Junchao Wei, 2014, 2014 International Conference on Prognostics and Health Management.

Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage

Pradeep Lall, Kewal Patel, Vikalp Narayan, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Analysis of Progressive Damage in Fuze Electronics using Micro-Computed Tomography and Finite Element Models

Pradeep Lall, Ryan Lowe, Nakul Kothari, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Flexible Wearable Biometric Band and Smartphone Application for Prevention of Sudden Causes of Death

Pradeep Lall, Hao Zhang, Rahul Lall, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Prognostics and health monitoring of electronic systems

Pradeep Lall, Kai Goebel, Ryan Lowe, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments

Pradeep Lall, Luu Nguyen, Shantanu Deshpande, 2016, 2016 IEEE International Conference on Prognostics and Health Management (ICPHM).

Outstanding Papers—2005

Herbert Reichl, Pradeep Lall, Richard C. Jaeger, 2005 .

HighSpeedDigital ImageCorrelation forTransient-Shock Reliability ofElectronics

Pradeep Lall, Dhananjay Panchagade, Jeff Suhling, 2007 .

BallGridArray(BGA)Solder Joint Intermittency

Pradeep Lall, 2008 .

Drop-Impact Reliability of Chip-Scale Packages in Handheld Products

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2003 .

Feature Vector Identification and Prognostics of SAC305 PCB’s for Varying Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker, 2020 .

Guidelines for Temperature-Tolerant Design and use of Electronic Packages

Michael Pecht, Pradeep Lall, Edward B. Hakim, 2020 .

A novel Micro-CT data based Finite Element Modeling technique to study reliability of densely packed fuze assemblies

Pradeep Lall, Ryan Lowe, Nakul Kothari, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Test Protocol for Assessment of Flexible Power Sources in Foldable Wearable Electronics under Stresses of Daily Motion during Operation

Pradeep Lall, Hao Zhang, P. Lall, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

Pradeep Lall, Vikrant More, Kai Goebel, 2009 .

Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads

Pradeep Lall, Madhura Hande, Chandan Bhat, 2011, IEEE Transactions on Industrial Electronics.

Risk Management Models for Flip-Chip Electronics in Extreme Environments

Jim Blanche, Pradeep Lall, Ganesh Hariharan, 2006 .

Extended Kalman Filter models and resistance spectroscopy for prognostication and health monitoring of leadfree electronics under vibration

Pradeep Lall, Kai Goebel, Ryan Lowe, 2011, 2011 IEEE Conference on Prognostics and Health Management.

Reliability of solid-state lighting electrical drivers subjected to WHTOL accelerated aging

Pradeep Lall, Lynn Davis, Peter Sakalaukus, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Pradeep Lall, Curtis W. Hill, Libby Creel, 2020 .

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Scott Miller, Ben Leever, 2019 .

Survivability assessment of electronics subjected to mechanical shocks up to 25,000g

Pradeep Lall, Ryan Lowe, Jason Foley, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Prognostication of solder-joint reliability of 0.4mm and 0.5mm pitch bgas subjected to mechanical shocks up to 10,000G

Pradeep Lall, Ryan Lowe, Jason Foley, 2015, 2015 IEEE Conference on Prognostics and Health Management (PHM).

Assembly-level reliability of flex-substrate BGA, elastomer-on-flex packages and 0.5 mm pitch partial array packages

Pradeep Lall, Kingshuk Banerji, 2000 .

An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions

Pradeep Lall, Lynn Davis, Peter Sakalaukus, 2015 .

Principal Component Analysis and Independent Component Analysis-Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas, 2021 .

Prognostics and condition monitoring of electronics

Pradeep Lall, James Hofmeister, Dhananjay Panchagade, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems

Pradeep Lall, James Hofmeister, Manish Kulkarni, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Pradeep Lall, Kai Goebel, Ryan Lowe, 2013 .

Transient dynamics model and 3D-DIC analysis of new-candidate for JEDEC JESD22-B111 test board

Di Zhang, Pradeep Lall, Andy Zhang, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Wire Bond Interconnects

Pradeep Lall, Yihua Luo, P. Lall, 2013 .

Correlation of Accelerated Tests with Human Body Measurements for Flexible Electronics in Wearable Applications

Pradeep Lall, Vikas Yadav, Tony Thomas, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Twist Reliability Assessment of Flexible Battery in Wearable Applications

Pradeep Lall, Scott Miller, Hyesoo Jang, 2020 .

Reliability of MEMS devices under multiple environments

Pradeep Lall, Lee Simpson, Jessica Glover, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Prognostics health management of electronic systems — A reliability physics approach

Pradeep Lall, Kazi Mirza, David Locker, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Prognostics using Kalman-Filter models and metrics for risk assessment in BGAs under shock and vibration loads

Pradeep Lall, Kai Goebel, Ryan Lowe, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Prediction of L70 lumen maintenance and chromaticity for LEDs using extended Kalman filter models

Pradeep Lall, Lynn Davis, Junchao Wei, 2013, Optics & Photonics - Optical Engineering + Applications.

Self-organized mapping of failure modes in portable electronics subjected to drop and shock

Pradeep Lall, Dhananjay Panchagade, Prashant Gupta, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Transactions on Components and Packaging Technologies Editors CPMT Transactions Editor-in-Chief

Mehmet Arik, Patrick McCluskey, Bahgat Sammakia, 2009 .

Prognostic indicators for Cu-Al wirebond degradation under operation at elevated temperature and combined temperature humidity

Pradeep Lall, Luu Nguyen, Shantanu Deshpande, 2014, 2014 International Conference on Prognostics and Health Management.

Fault-mode classification for health monitoring of electronics subjected to drop and shock

Pradeep Lall, Dhananjay Panchagade, Prashant Gupta, 2009, 2009 59th Electronic Components and Technology Conference.

Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics

Pradeep Lall, Dhananjay Panchagade, Sandeep Shantaram, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

RUL Estimations of SAC305 Solder PCB's under Different Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

High strain-rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature

Di Zhang, Pradeep Lall, Vikas Yadav, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Development of an alternative wire bond test technique

Pradeep Lall, Michael Pecht, Donald Barker, 1994 .

Anomaly detection and fault-mode isolation for prognostics health monitoring of electronics subjected to drop and shock

Pradeep Lall, Prashant Gupta, Arjun Angral, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

A Life-Cycle Approach To Design And Manufacturing Simulation Of Multichip Modules

Michael Pecht, Pradeep Lall, 1996 .

Method for Assessment of Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Scott Miller, Ben Leever, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Feature Extraction and RUL Prediction of SAC Solder Alloy Packages by Different Statistical and Time-frequency Analysis Techniques under Simultaneous Temperature-Vibration Loads

Pradeep Lall, Tony Thomas, Jeff Suhling, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Testing and Reliability Characterization Methods for Flexible Hybrid Electronics

Pradeep Lall, Kartik Goyal, Jinesh Narangaparambil, 2020 .

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Pradeep Lall, Jeffrey C. Suhling, Richard C. Jaeger, 2013 .

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Jeffrey C. Suhling, Wayne Johnson, 2007 .

Improved finite element modeling strategies with multipoint constraints for BGA packages subjected to thermal cycling

Pradeep Lall, Jeffrey C. Suhling, Chienchih Chen, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Guidelines for Temperature-Tolerant Design and use of Microelectronic Devices

Michael Pecht, Pradeep Lall, Edward B. Hakim, 2020 .

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Lynn Davis, Peter Sakalaukus, 2013 .

Improvements to the IES TM-28-14 Lumen Maintenance Standard: A Generalized Acceleration Factor Approach for Solid-State Lighting

Pradeep Lall, Lynn Davis, Peter Sakalaukus, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Feature extraction and damage-precursors for prognostication of lead-free electronics

Jay Lee, Pradeep Lall, Madhura Hande, 2006, 56th Electronic Components and Technology Conference 2006.

Fault-isolation in portable electronics subjected to drop and shock

Pradeep Lall, Dhananjay Panchagade, Prashant Gupta, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Development Of An Alternative Wire Bond Test Technique

Pradeep Lall, Michael Pecht, Donald Barker, 1992, Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.

Effect of simultaneous high temperature and vibration on MEMS based vibratory gyroscope

Pradeep Lall, Amrit Singh Abrol, Lee Simpson, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Leading Indicators of Damage for Prognostication of Leadfree Electronics Subjected to Multiple Thermo-Mechanical Environments

Pradeep Lall, Vikrant More, Kai Goebel, 2009 .

Temperature as a Reliability Factor

Pradeep Lall, Michael Pecht, Edward B. Hakim, 2020, Influence of Tempemture on Microelectronics and System Reliability.

Life prediction and classification of failure modes in solid state luminaires using Bayesian Probabilistic Models

Pradeep Lall, Peter Sakalaukus, Junchao Wei, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics

Pradeep Lall, Kai Goebel, Ryan Lowe, 2012, IEEE Transactions on Industrial Electronics.

Guest Editorial

Pradeep Lall, Robert Neal Dean, Mathias Nowottnick, 2011, IEEE Transactions on Industrial Electronics.

Assessment of reliability of missile fuze using micro-CT data based finite element technique with digital volume correlation

Pradeep Lall, Ryan Lowe, Nakul Kothari, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Bayesian models for life prediction and fault-mode classification in solid state lamps

Pradeep Lall, Peter Sakalaukus, Junchao Wei, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Capacity Degradation of Flexible Li-Ion Power Sources Subjected to Shallow Discharging

Pradeep Lall, Scott Miller, Amrit Abrol, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Keynote Presentation Prognostics and Condition Monitoring of Electronics

Pradeep Lall, James P. Hofmeister, P. Lall, 2009 .

Board trace fatigue models and design guidelines for electronics under shock-impact

Pradeep Lall, Jeff Suhling, Arjun Angral, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Improved Submodeling Finite Element Simulation Strategies for BGA Packages Subjected to Thermal Cycling

Pradeep Lall, Jeffrey C. Suhling, Chienchih Chen, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

A PoF approach to addressing defect-related reliability

Pradeep Lall, R. Bauernschub, P. Lall, 1994, Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium.

SSL and LED life prediction and assessment of CCT shift

Pradeep Lall, Lynn Davis, Peter Sakalaukus, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

PHM-based residual life computation of electronics subjected to a combination of multiple cyclic-thermal environments

Pradeep Lall, Vikrant More, Kai Goebel, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics

Pradeep Lall, Kai Goebel, Mahendra Harsha, 2015 .

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Pradeep Lall, Tony Thomas, 2018 .

The influence of temperature on integrated circuit failure mechanisms

Pradeep Lall, Michael Pecht, Edward B. Hakim, 1992 .

Prognostication of remaining useful-life for flexible batteries in foldable wearable electronics

Hao Zhang, Pradeep Lall, H. Zhang, 2016, 2016 IEEE International Conference on Prognostics and Health Management (ICPHM).

Anomaly-Detection and Prognostication of Electronics Subjected to Shock and Vibration

Pradeep Lall, Jeffrey C. Suhling, Prashant Gupta, 2009 .

Study on Folding-Reliability of Wearable Biometric Band

Curtis Hill, Pradeep Lall, Libby Creel, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Models for Reliability of Fine-Pitch BGAs and CSPs in Shock and Drop Impact

Pradeep Lall, Jeffrey C. Suhling, Wayne Johnson, 2004 .

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Wei Liu, Vikas Yadav, 2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.

Novel Flexible Bioelectronics Device and Software Application for Prevention of Sudden Causes of Death

Pradeep Lall, Hao Zhang, Rahul Lall, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Effect of Mean Temperature on the Evolution of Strain-Amplitude in SAC Ball-Grid Arrays during Operation under Thermal Aging and Temperature Excursions

Pradeep Lall, Jeff Suhling, Kazi Mirza, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Model for prediction of package-on-package warpage and the effect of process and material parameters

Pradeep Lall, Kewal Patel, Vikalp Narayan, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Prognostication of Damage in Automotive Underhood Electronics Subjected to Temperature and Vibration

Tony Thomas, Pradeep Lall, Jeff Suhling, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Prognostic Health Monitoring of Damage Progression in Leadfree Electronics Under Sequential Exposure to Thermal Aging and Thermal Cycling

Pradeep Lall, Vikrant More, Kai Goebel, 2010 .

Pradeep Lall, Kai Goebel, Prashant Gupta, 2011, 2011 IEEE Conference on Prognostics and Health Management.

PBGA package Finite Element Analysis based on the physical geometry modeling using X-ray micro CT digital volume reconstruction

Pradeep Lall, Junchao Wei, P. Lall, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Prognostication of the effect of mean temperature of thermal cycle on SAC305 leadfree reliability using damage pre-cursors

Pradeep Lall, Kazi Mirza, 2014, 2014 International Conference on Prognostics and Health Management.

Process Development and Performance Analysis of Additively Printed Humidity Sensor using Aerosol Jet Printing

Pradeep Lall, Jinesh Narangaparambil, P. Lall, 2020, 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Prognostication of LED remaining useful life and color stability in the presence of contamination

Hao Zhang, Pradeep Lall, Lynn Davis, 2015, 2015 IEEE Conference on Prognostics and Health Management (PHM).

Accrued Damage and Remaining Life in Field Extracted Assemblies Under Sequential Thermo-Mechanical Loads

Pradeep Lall, Kai Goebel, Jeffrey C. Suhling, 2011 .

Effects of aging on SAC-Bi solder materials

Pradeep Lall, Jeffrey C. Suhling, Munshi Basit, 2016, 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

The effects of SAC alloy composition on aging resistance and reliability

Pradeep Lall, Jeffrey C. Suhling, Michael J. Bozack, 2009, 2009 59th Electronic Components and Technology Conference.

Reduction of lead free solder aging effects using doped SAC alloys

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Pradeep Lall, Jeffrey C. Suhling, Mohammad Motalab, 2015 .

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, David Locker, 2015 .

Color shift analysis and modeling of high power warm white pc-LED under high temperature and high humidity environment

Pradeep Lall, Lynn Davis, Hao Zhang, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Thermal cycling reliability of aged PBGA assemblies - comparison of Weibull failure data and finite element model predictions

Pradeep Lall, Jeffrey C. Suhling, John L. Evans, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Assembly-level reliability characterization of chip-scale packages

Pradeep Lall, K. Banerji, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Prediction of L70 Life and Assessment of Color Shift for Solid-State Lighting Using Kalman Filter and Extended Kalman Filter-Based Models

Pradeep Lall, P. Lall, Junchao Wei, 2015, IEEE Transactions on Device and Materials Reliability.

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

Pradeep Lall, Shantanu Deshpande, Luu Nguyen, 2015 .

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, Jeffrey C. Suhling, 2007 .

Effects of aging on shear cyclic stress strain and fatigue behaviors of lead free solder joints

Pradeep Lall, Jeffrey C. Suhling, Jordan C. Roberts, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Influence of Temperature on Microelectronics and System Reliability : A Physics of Failure Approach

Pradeep Lall, Michael Pecht, Edward B. Hakim, 2020 .

A Physics-of-Failure Approach to IC Burn-In

Pradeep Lall, Michael Pecht, Edward B. Hakim, 2020 .

Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

Pradeep Lall, Jeffrey C. Suhling, Nusrat J. Chhanda, 2011 .

L70 life prediction for solid state lighting using Kalman Filter and Extended Kalman Filter based models

Pradeep Lall, Lynn Davis, P. Lall, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Remaining Useful Life Assessment of Field Deployed Electronics Using X-Ray Micro-CT Based Digital Volume Correlation and Finite-Element Analysis

Pradeep Lall, Junchao Wei, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

X-ray micro-CT and digital-volume correlation based three-dimensional measurements of deformation and strain in operational electronics

Pradeep Lall, P. Lall, Junchao Wei, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Principal component analysis based development of Norris-Landzberg acceleration factors and Goldmann Constants for leadfree electronics

Pradeep Lall, Aniket Shirgaokar, Dinesh Arunachalam, 2009, 2009 59th Electronic Components and Technology Conference.

Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact

Pradeep Lall, Sandeep Shantaram, Arjun Angral, 2009, 2009 59th Electronic Components and Technology Conference.

Development of FE Models and Measurement of Internal Deformations of Fuze Electronics Using X-Ray MicroCT Data with Digital Volume Correlation

Pradeep Lall, Ryan Lowe, Nakul Kothari, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Damage pre-cursor based assessment of impact of high temperature storage on reliability of leadfree electronics

Pradeep Lall, Kai Goebel, Mahendra Harsha, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys

Pradeep Lall, Sandeep Shantaram, P. Lall, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Principal components regression model for prediction of life-reduction in SAC leadfree interconnects during long-term high temperature storage

Pradeep Lall, Sree Mitun Duraisamy, Jeff Suhling, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Damage pre-cursor based life prediction of the effect of mean temperature of thermal cycle on the SnAgCu solder joint reliability

Pradeep Lall, Kazi Mirza, P. Lall, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Package-level multiphysics simulation of Cu-Al WB corrosion under high temperature/humidity environmental conditions

Pradeep Lall, Yihua Luo, P. Lall, 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Characterization of functional relationship between temperature and microelectronic reliability

Pradeep Lall, Michael Pecht, Edward B. Hakim, 1995 .

Thermal cycling reliability of lead‐free chip resistor solder joints

Pradeep Lall, R. Wayne Johnson, Jeffrey C. Suhling, 2004 .

Development of Test Protocols for the Flexible Substrates in Wearable Applications

Pradeep Lall, Amrit Abrol, Jinesh Narangaparambil, 2018, 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

Pradeep Lall, Dhananjay Panchagade, D. Iyengar, 2009 .

Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity

Pradeep Lall, Shantanu Deshpande, Masood Murtuza, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders

Pradeep Lall, Jeffrey C. Suhling, Jordan C. Roberts, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Prognostication of latent damage and residual life in leadfree electronics subjected to multiple thermal-environments

Pradeep Lall, Vikrant More, Kai Goebel, 2009, 2009 59th Electronic Components and Technology Conference.

The effects of aging on the fatigue life of lead free solders

Pradeep Lall, Jeffrey C. Suhling, Jordan C. Roberts, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging

Pradeep Lall, Jeffrey C. Suhling, Nusrat J. Chhanda, 2013 .

DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint

Pradeep Lall, Jeffrey C. Suhling, Kazi Mirza, 2015 .

LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation

Pradeep Lall, Junchao Wei, 2015 .

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

Pradeep Lall, Hao Zhang, 2015 .

Nano-Underfills for High-Reliability Applications in Extreme Environments

Pradeep Lall, Jeffrey C. Suhling, Guoyun Tian, 2005, ECTC 2005.

Solid State Lighting Life Prediction Using Extended Kalman Filter

Pradeep Lall, Lynn Davis, Junchao Wei, 2013 .

Thermomechanical failures in microelectronic interconnects

Pradeep Lall, S. L. Cornford, J. Y. Evans, 1998 .

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

Pradeep Lall, Jeffrey C. Suhling, P. Choudhary, 2005 .

Characterization of microprocessor chip stress distributions during component packaging and thermal cycling

Pradeep Lall, Richard C. Jaeger, Jeffrey C. Suhling, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Non-destructive crack and defect detection in SAC solder interconnects using cross-sectioning and X-ray micro-CT

Pradeep Lall, Shantanu Deshpande, P. Lall, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Correlation of reliability models including aging effects with thermal cycling reliability data

Pradeep Lall, Jeffrey C. Suhling, John L. Evans, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Characterization of aging effects in lead free solder joints using nanoindentation

Pradeep Lall, Jeffrey C. Suhling, Barton C. Prorok, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Pradeep Lall, Amrit Abrol, David Locker, 2017 .

Temperature dependence of microelectronic device failures

Pradeep Lall, Michael Pecht, M. Pecht, 1990 .