Y.H. Lim

Novel dielectric slots in Cu interconnects for suppressing stress-induced void failure

K. Pey, Y. K. Lim, L. Hsia, 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

Development of Bonded Wafer Analysis System

D. Jang, Chang-Woo Ban, Y.H. Lim, 2009 .

Stress-induced voiding beneath vias with wide copper metal leads

A. See, K. Pey, Y.K. Lim, 2004, Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743).

Stress-induced voiding in multi-level copper/low-k interconnects

K. Pey, C. Seet, Y.K. Lim, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.