K. Nemoto

Advanced monitoring method for copper interconnect process

Kenji Watanabe, T. Funakoshi, M. Ikota, 2007, 2007 International Symposium on Semiconductor Manufacturing.

Advanced Monitoring Method for Copper Interconnect Process ISSM Paper: PC-O-202

Kenji Watanabe, T. Funakoshi, M. Ikota, 2007 .

Process integration of single-wafer technology in a 300-mm fab, realizing drastic cycle time reduction with high yield and excellent reliability

Y. Sasaki, Michimasa Funabashi, K. Nemoto, 2003 .