K. Tomita

Reducing Reverse-Bias Current in 450°C-Annealed n+p Junction by Hydrogen Radical Sintering

T. Shibata, T. Ohmi, A. Nakada, 1995 .

Effects of Ru-Ta Alloy Barrier on Cu Filling and Reliability for Cu Interconnects

K. Asai, K. Maekawa, M. Kojima, 2008, 2008 International Interconnect Technology Conference.

Eliminating Metal‐Sputter Contamination in Ion Implanter for Low‐Temperature‐Annealed, Low‐Reverse‐Bias‐Current Junctions

Tadashi Shibata, Tadahiro Ohmi, Takahisa Nitta, 1995 .