Tsung-Hsun Yang

Morphology evolution in TiN/Al-0.5Cu/Ti interconnection during chamber long stay and post-deposition annealing correlated to defect formation in metallization processing

Ming-yen Li, B. Tsai, Mei-Yun Su, 2008 .

Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations

Tsung-Hsun Yang, Kuen-Song Lin, Cheng-En Ho, 2013, Microelectron. Reliab..

Depletion and phase transformation of a submicron Ni(P) film in the early stage of soldering reaction between Sn-Ag-Cu and Au/Pd(P)/Ni(P)/Cu

C.E. Ho, W. Hsieh, Tsung-Hsun Yang, 2015, Electronic Materials Letters.