Tung-Ying Lee
发表
H. Hsu,
L. Hsu,
F. Tsai,
2019,
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Investigation and optimization of STI dry-etch induced overlay through patterned wafer geometry tool
Tung-Ying Lee,
Tsu-Wen Huang,
Ying-Cheng Chuang,
2021,
Advanced Lithography.