M. Fukui

Suppression of stress-induced voiding in copper interconnects

E. Murakami, T. Oshima, K. Hinode, 2002, Digest. International Electron Devices Meeting,.

Phase field simulations of stress distributions in solidification structures

N. Ohno, T. Uehara, M. Fukui, 2008 .

Numerical Analysis on Microstructure Formation and Stress Distribution by Using the Phase Field Model

N. Ohno, T. Uehara, M. Fukui, 2008 .

Phase Field Simulation of Stress Evolution during Grain Growth Process

N. Ohno, T. Uehara, M. Fukui, 2007 .