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W. K. Choi, C. Thompson, K. Pey, 2007 .

Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects

W. K. Choi, C. Thompson, K. Pey, 2003 .

Investigation and optimization of STI dry-etch induced overlay through patterned wafer geometry tool

Tung-Ying Lee, Tsu-Wen Huang, Ying-Cheng Chuang, 2021, Advanced Lithography.